| Material compatibility | Substrate resin, overmold resin, hardness, bond method, and operating conditions. | Poor compatibility can cause peeling, weak bonding, or failure during use. |
| Bonding method | Chemical bond, mechanical lock, undercuts, holes, ribs, or textured bonding surfaces. | Bonding should not rely on hope; the geometry should support the material behavior. |
| Wall thickness | Overmold thickness, transitions, edge details, and flow path. | Very thin or uneven sections can create short shots, sink, weak areas, or inconsistent feel. |
| Shutoff surfaces | Where the second material starts and stops, including flash-sensitive cosmetic edges. | Good shutoff design helps control flash and creates clean material boundaries. |
| Substrate support | How the first part is held in the mold during the second shot. | The substrate must stay located and stable under heat, pressure, and injection force. |
| End-use testing | Pull, peel, torque, impact, chemical exposure, sealing, or grip validation | grip validation. Overmolding success should be judged by final product performance, not appearance alone. |