| Part still too hot or under-cooled at mold open | Soft dimples or gloss at many pins; marks reduce when cooling time increases in controlled steps | Extend cooling within a stable window; compare part temperature near pins to setup sheet, not only cycle timer |
| Excessive pack or hold that over-clamps the part onto the core | Whitening or bulging at pins while dimensions look heavy; worsens when hold pressure rises | Reduce hold in steps; confirm gate seal and check sink before accepting heavy pack as permanent |
| High contact stress from small pin diameter on a thin wall or small pad | Punch-through or deep dimple at one pad; mark profile matches pin face | Redistribute ejection with additional pins or blade-style support; thicken pin pad region in CAD if cosmetic class allows |
| Release resistance from insufficient draft, rough ribs, or deep cores that grip plastic | Marks at pins on the same side as scuffing on walls; release spray trial helps briefly | Review draft and polish direction on sticking features; see drag mark guidance when scuffs run along walls |
| Unbalanced ejection, bent pin, wrong pin height, or binding ejector plate | One cavity or one pin only; mark returns after process tweaks | Inspect pin and bore, plate parallelism, and stroke sequence; verify pin flush to cavity surface per mold print |
| Ejection too fast for part stiffness or handling after drop | Marks worsen when ejection speed increases; parts may tilt off the pin side | Slow ejection speed; confirm robot or conveyor pickup does not bend the part on the pin side |